夜夜天天噜狠狠爱2019

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      Home > News > Printed circuit board plating process and PCB plating equipment characteristics

      Printed circuit board plating process and PCB plating equipment characteristics

      Publisher:Admin  Mingdian Mechinery     Release date:2016/6/2

      Printed circuit board can be formed industrialization, large-scale production, the most important is due to some well-known international companies in the 1960s introduced patented formula related to electroless copper and palladium colloid patented formula. Through-hole printed circuit board using the electroless copper plating for its industrialization, large-scale production and automated production and lay a good foundation. It has become accepted by all manufacturers of printed circuit board manufacturing one of the basic processes.

          (1) pattern plating method
          CCL a deburring drilling a clearing of a surface treated a weak activation of a chemical etching a copper etching a full plate copper plating a pattern imaging a pattern plating copper-tin-lead or nickel and gold in addition to resist a ham an etching agent, a hot melt coating a solder resist layer
          (2) the entire board plating
          CCL a deburring drilling a clearing of a surface treated a weak activation of a chemical etching a copper plate a whole a copper foil or a screen printing etch resist a ham a solder resist coating or a hot air leveling electroless nickel gold
          In the above printed circuit board manufacturing process in both electroless copper plating, electroless copper plating is a printed circuit board production process very important aspect. Characterized electroless copper plating solution containing a complexing or chelating agent. Reducing its use of formaldehyde.
          Electroless copper plating solution, complexing agent and formaldehyde and other substances harmful to the environment will have great difficulties in wastewater treatment. In addition, the electroless copper plating bath maintenance and management there are certain difficulties. But still the electroless copper plating of printed circuit board production process can not be ignored.
          PCB printed circuit board plating automatic production line features:
          1, advanced design and production of circuit boards for a variety of applications;
          2, can accurately control various syrup added, to achieve maximum effect;
          3, rich work experience, with a Chinese herb suppliers that can provide total solutions to meet customer requirements;
          4, the cathode into the swing angle of 15 °, the plating tank attached to the motor vibration means for providing quality plating fine lines and small aperture;
          5, attached to the cathode float planes, providing plating uniformity;
          6, 2 per month between 1000 to 30,000 square meters, can optionally deep grooves or slots money, the anode is copper or titanium copper-clad.
          Shenzhen Branch-Thai Plating Equipment Co., Ltd. specializes in plating whole plant equipment for the planning, design, manufacture, installation and after-sales service for the integrated enterprise, design and production of hardware, electronics plating equipment, the main full (semi) automatic gantry cranes plating, barrel plating line; automatic hydraulic ring hanging plating line, under the rail loop automatic hanging plating electroplating Machinery and PCB plating line; I company of "quality first, customers first, fast service, real materials," the purpose, we would like to friendship and cooperation with all the new and old customers and common progress and create success.
          This paper Shenzhen Branch-Thai Plating Equipment Co. collection edited by professional plating equipment manufacturers, this article does not represent the Company's views as well as any website, sharing a purely circuit board industry information.


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      夜夜天天噜狠狠爱2019
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