ET News According to Korean media reports, a few days ago the trade rumors, Apple in the fall of 2016 upcoming new smart phone iPhone 7 (provisional), the package will be powered using FOWLP chip technology, so that the new iPhone thinner, lower manufacturing costs .
Apple decided previously in the antenna switch module (Antenna Switching Module; ASM) Import FOWLP on the package; It is understood that Apple has recently decided to import FOWLP encapsulated in the processor (AP) on.
Should this happen, Apple will be the first decision to adopt the smartphone main parts FOWLP packaging industry. ASM chip is responsible for receiving various frequency signals to provide switching function; mobile AP is playing smart phone or tablet (Tablet PC) of the brain function.
FOWLP semiconductor packaging technology is one of the package, without the use of printed circuit boards can be directly packaged on the wafer, and therefore production costs are lower, and the thin, heat dissipation preferred. Apple decided to use this technology is that it hopes to lower costs, to create a slimmer, better performance of the phone.
Because Apple sold 100 million units a year iPhone, if the future use FOWLP package and the printed circuit board is bound to affect the market demand.
On the printed circuit board market for semiconductor printed circuit board belonging to the higher value-added products. 2015 global semiconductor PCB market size of about $ 8.4 billion, but in the face of new technologies and decisions that affect Apple's future would have difficulty maintaining the same size of the market.
Industry forecasts, although there is only Apple decided to use the ASM and AP FOWLP package, but the future is likely to expand the technology to other parts, other industry players may follow, so the printed circuit board market is shrinking just a matter of time.
South Korean electronic circuit Industry Association (KPCA) official said, semiconductor technology will inevitably affect the sustainable development of the printed circuit board market, as soon as possible in the Internet of Things (IoT) or wearable devices such new product development and market in order to reduce the development of semiconductor technology with to impact.
Source: Electronic Products